American Council of Engineering Companies of Wyoming Scholarship, Wyoming, 2013 2014
The American Council of Engineering Companies of Wyoming is funding Scholarship Program for Undergraduate Students in Engineering and Applied Science, Wyoming, 2013 2014
Scholarship Program: American Council of Engineering Companies of Wyoming Scholarship 2013-2014
Type of Award: Scholarships
Nationality: Scholarships is open for U.S. citizens.
Employer: The American Council of Engineering Companies of Wyoming is supporting scholarship program.
Level of study: Scholarships is open for Undergraduate program.
Subject(s): Scholarship in the field of Engineering and Applied Science.
Duration: Scholarships duration is one academic year.
Number of awards: The number of awards for this scholarship program is 3.
Am I eligible? Students seeking the awards must be United States citizens or permanent residents, enrolled in the College of Engineering and Applied Science at the University of Wyoming, and have a grade point average of at least 2.5.
How do I apply? Applications material must be submitted through By Post.
What does it cover? Scholarship awards totaling $8,000 for the 2013-2014 academic year.
Scholarship Description: The American Council of Engineering Companies of Wyoming (ACEC of Wyoming) is offering three scholarship awards totaling $8,000 for the 2013-2014 academic year. One $3,000 scholarship will be awarded to a student who expects to graduate in December of 2013, May 2014, or August 2014. One $3,000 scholarship will be awarded to a student who will be a Junior at the beginning of the Fall 2013 semester. One $2,000 scholarship will be awarded to a student who will be either a Junior or Senior at the beginning of the Fall 2013 semester.
Application closing date: Applications must be received by January 25, 2013
Further Scholarship Information and Application
Category: Engineering, Science, Undergraduate Scholarships, Grants and Fellowships Programs
Subscribe
If you enjoyed this article, subscribe to receive more just like it.
